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Technische Universität München
Technische Universität München

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2024

  • Bicer, E. A.; Schirmer P.; Schreivogel P.; Schrag G.: Mesago PCIM GmbH (Hrsg.): Neural Network Assisted Numerical Simulation Benchmarking for Electric Vehicle Thermal Management System. VDE VERLAG GMBH, 2024 mehr…
  • Bosetti, G.; Bretthauer, C.; Bogner, A.; Krenzer, M.; Gierl, K.; Heiss, H.; Schrag, G.: Design Optimization of a Corrugated Piezoelectric MEMS Microphone applying Genetic Algorithms. 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), IEEE, 2024 mehr…
  • Bosetti, G.; Hofstetter-Spona, S.; Schrag, G.: Freeform Optimization of an Ultrasonic Horn Coupled to an Airborne MEMS Transducer. Eurosensors 2023, MDPI, 2024 mehr…
  • Friebe, T.; Schrag, G.; Bosetti, G.; Bretthauer, C.: C3.2 - Piezoelektrische MEMS-Mikrofone mit Regelung durch Kraftrückkopplung. Vorträge, AMA Service GmbH, Von-Münchhausen-Str. 49, 31515 Wunstorf, 202422. GMA/ITG-Fachtagung Sensoren und Messsysteme 2024, 236-240 mehr…
  • Leikam, B.; Pandey, S.; Hayden, O.; Schrag, G.: Design Studies and Optimization of Acoustic Pressure in Acoustofluidic Cell Manipulation Platforms. 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), IEEE, 2024, 1-5 mehr…
  • Okeil, H.; Erlbacher, T.; Wachutka, G.: Very High In-Plane Magnetic Field Sensitivity in Ion-Implanted 4H-SiC PIN Diodes. , Hrsg.: Advanced Electronic Materials Open Access: Technische Universität München, 2024, mehr…
  • Okeil, H.; Erlbacher, T.; Wachutka, G.: Very High Temperature Hall Sensors in a Wafer‐Scale 4H‐SiC Technology. Advanced Materials Technologies, 2024, 2400046-2400060 mehr…
  • Okeil, H.; Wachutka, G.: 4H–SiC Vertical Magnetotransistor with Microtesla Detectivity up to 500 °C. Applied Physics Letters 124 (124/19), 2024, 192101 mehr…
  • Okeil, H.; Wachutka, G.: 4H-SiC Lateral Magnetotransistor with Sub-Microtesla In-Plane Magnetic Field Detectivity. IEEE Electron Device Letters, 2024, 1-1 mehr…
  • Okeil, H.; Wachutka, G.: 500 °C Microtesla Sensitive Magnetic Field Sensing Using a 4H-SiC PIN Diode. IEEE SENSORS JOURNAL VOL. 24 (NO. 19), 2024, 29884-29889 mehr…
  • Philippin, N.; Kuehne, I.; Schrag, G.: Conformable Electronics with Conductive Silver Structures by Electrohydrodynamic Printing. IEEE Journal on Flexible Electronics, 2024, 1-1 mehr…
  • Philippin, N.; Kuehne, I; Schrag, G.: Electrohydrodynamic Printing of Conductive Microstrips on Hyperelastic Substrates for Fabrication of Flexible and Stretchable Sensors. 2024 IEEE International Conference on Flexible and Printable Sensors and Systems (FLEPS), IEEE; VDE, 2024, 1-4 mehr…
  • Schiller, F.; Bretthauer, C.; Bogner, A.; Bosetti, G.; Krenzer, M.; Gierl, K.; Haupt, C.; Heiss, H.: OT1.173 - High-Fidelity Modeling of Harmonic Distortions in Piezoelectric MEMS Microphones with a Corrugated Membrane. Lectures, AMA Service GmbH, Von-Münchhausen-Str. 49, 31515 Wunstorf, 2024EUROSENSORS XXXVI, 33-34 mehr…
  • Xu, J.; Schrag, G.; Shao, Z.: Machine Learning Strategies for Freeform PMUTs Design. IEEE International Ultrasonics Symposium (IUS), 2024, 4 mehr…

2023

  • Bicer, E. A.; Schirmer, P. A.; Schreivogel, P.; Schrag, G.: Electric Vehicle Thermal Management System Modeling with Informed Neural Networks. 2023 25th European Conference on Power Electronics and Applications (EPE'23 ECCE Europe), IEEE, 2023, 1-8 mehr…
  • Bosetti, G.; Bretthauer, C.; Bogner, A.; Krenze, M.; Gierl, K.; Timme, H.-J.; Heiss, H.; Schrag, G.: A Novel High-SNR Full Bandwidth Piezoelectric MEMS Microphone Based on a Fully Clamped Aluminum Nitride Corrugated Membrane. 2023 22nd International Conference on Solid-State Sensors, Actuators and Microsystems (Transducers), IEEE Xplore, 2023 mehr…
  • Bosetti, G.; Bretthauer, C.; Steinberger, M.; Gierl, K.; Krenzer, M.; Schrag, G.: Single-Layer Corrugated Aluminum Nitride Membranes as Piezoelectric Micromachined Ultrasonic Transducers with Differential Readout and Actuation. 2023 IEEE International Ultrasonics Symposium (IUS), IEEE, 2023 mehr…
  • Bosetti, G.; Hofstetter-Spona, S.; Schrag, G.: On the Use of 3D-Printed Ultrasonic Horns to Tune the Frequency Response of Airborne MEMS Transducers. 2023 22nd International Conference on Solid-State Sensors, Actuators and Microsystems (Transducers), IEEE, 2023 mehr…
  • Essing, S.; Mittereder, T.; Tumpold, D.; Schrag, G.: Predictive Modelling of Emitter Systems in Photoacoustic Gas Sensing. 2023 Symposium on Design, Test, Integration & Packaging of MEMS/MOEMS (DTIP), IEEE, 2023 mehr…
  • Essing, S.; Schrag, G.; Tumpold, D.; Dumas, G.; Ghaderi, M.; Kravchenko, A.: C3.4 - Everything at once—Linearizing System Response and Enhancing Sensitivity in Photoacoustic Gas Sensors by Demodulation and Filter Tuning. Lectures, AMA Service GmbH, Von-Münchhausen-Str. 49, 31515 Wunstorf, Germany, 2023 mehr…
  • Essing, S.; Trautmann, M.; Tumpold, D.; Schrag, G.: Humidity Sensing for free—advanced thermoacoustic signal models in miniaturized photoacoustic gas sensors. 2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), IEEE, 2023 mehr…
  • Gaßner, S.; Schmitt, K.; Wöllenstein, J.; Tumpold, D.; Essing, S.: E7.1 - Miniaturized SMD-Reflow-Capable Photoacoustic CO2-Sensor Using a Dual-Chamber Approach. Lectures, AMA Service GmbH, Von-Münchhausen-Str. 49, 31515 Wunstorf, Germany, 2023 mehr…
  • Hölzl, Wolfgang; Seidl, Martin; Schrag, Gabriele: Fully-Coupled Transient Modeling of Highly Miniaturized Electrostatic Pull-In Driven Micropumps. 2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2023 mehr…
  • Michael, F.; Schrag, G.: Simulation von Dämpfungseffekten in unregelmäßig perforierten MEMS Bauteilen durch Kompaktmodelle. MikroSystemTechnik Kongress 2023, 2023 mehr…
  • Michael, F.; Schrag, G.: „Simulation of Damping Effects in Irregularly Perforated MEMS Devices by Physical Compact Modeling“. SMSI 2023 - Sensor and Measurement Science International, 2023, https://www.ama-science.org/proceedings/details/4408 mehr…
  • Okeil, H.; Schrag, G.; Wachutka, G.: High-Throughput Apparatus for Semiconductor Device Characterization in a Magnetic Field at Extreme High Temperatures. IEEE Transactions on Instrumentation and Measurement 72, 2023, 1-8 mehr…
  • Philippin, N.; Kuehne, I.; Schrag, G.: Electric-Field-Assisted Printing Technology for Enhanced Patterning of Micro- and Nanostructures. MikroSystemTechnik Kongress, 2023, 205-210 mehr…

2022

  • Bajt A.; Bosetti G.; Poongodan P. K.; Schrag G.; Vanselow F.: A Physics-Based Interpolation Method for Rapid Dimensioning of pMUT Designs. EuroSimE, 2022 mehr…
  • Bosetti G.; Schrag G.: Efficient Modeling of Acoustic Channels – Towards Tailored Frequency Response of Airborne Ultrasonic MEMS Transducers. EuroSimE, 2022 mehr…
  • Essing S.; Schrag G.; Tumpold D.; Glacer C.; Mihotek M.; Kravchenko A.: Towards predictive system-level modelling of miniaturized photoacoustic gas sensors. EuroSimE, 2022 mehr…
  • S. Essing; G. Schrag; D. Tumpold: Simulating Miniaturized Open Photoacoustic Gas Sensors. Sensors and Measuring Systems; 21th ITG/GMA-Symposium, 2022 mehr…
  • S. Gassner; R. Schaller; M. Eberl; C. Koblinski , S. Essing; M. Ghaderi ; K. Schmitt, J. Wöllenstein: Anodically Bonded Photoacoustic Transducer: An Approach towards Wafer-Level Optical Gas Sensors. sensors, 2022 mehr…
  • Udiljak D.; Pufall R.; Reuther G. M.; Boudaden J.; Ramm P.; Schrag G.: Humidity and corrosion susceptibility of molded packages under mechanical impact Novel package level impact test to provoke micro-damage. EuroSimE, 2022 mehr…

2021

  • Annuth, R.; Hölzl, W.; Bosetti, G.; Schrag, G.: "Optimization of the Electrical Excitation for a Bionically Inspired Fluid-Actuator". DTIP, 2021 mehr…
  • Durasiewicz, C. P.; Güntner, S. T.; Maier, P. K.; Hölzl, W.; Schrag, G.: "Piezoelectric Normally Open Microvalve with Multiple Valve Seat Trenches for Medical Applications". Applied Sciences, 2021 mehr…
  • Durasiewicz, C. P.; Güntner, S.; Kibler, S.: "Piezoceramic Mounting Process and Adapted Pretension for Improved Microvalve Functionality and Reliability". MikroSystemTechnik Kongress, 2021 mehr…
  • Durasiewicz, C. P.; Hölzl, W.; Schrag, G.: ""Safety Valve": A Metal Based, Self-Securing Switchable Microvalve for Medical Applications". MikroSystemTechnik Kongress, 2021 mehr…
  • Grünerbel, L.; Leikam, B.; Schrag, G.: "Experimental Characterization Method for Passive Microvalves in Diaphragm Pumps for Medical Apllications". MikroSystemTechnik Kongress, 2021Stuttgart- Ludwigsburg mehr…
  • Helmut, D.; Groos, G.; Wachutka, G., and Schrag, G.: "Measuring Transient I/V Turn-On Behavior of a Power MOSFET without a Current Sensor". INTERNATIONAL SEMINAR ON POWER SEMICONDUCTORS (ISPS21), 2021 mehr…
  • Leistner, H.; Anheuer, D.; Bosetti, G.; Schrag, G.; Richter, M.: "Modeling and Manufacturing of an Electrostatic Actuator for Micropumps". MikroSystemTechnik Kongress, 2021 mehr…
  • Schönmann, R.; Van, H.; Schrag, G; Wachutka, G.; Ramm, P.; Müller, A.; Mai, W.: "Contamination Propagation Under High Vacuum Conditions: Simulation and Experimental Study". VII International Conference on Particle-based Methods PARTICLES, 2021 mehr…
  • Seidl, M.; Schrag, G.; Tumpold, D.; Klein, W.: "Miniaturisierung hochsensitiver, hitzdrahtbasierter Massenflusssensoren mit Hilfe von Halbleiterfertigungstechnologie". MikroSystemTechnik Kongress, 2021 mehr…
  • Seyfert, L.; Ben Ammar, H.; Schwesinger, N.: "Contribution of flexoelectricity in piezoelectric PVDF films for EH applications". SPIE Smart Structures + Nondestructive Evaluation, 2021 mehr…
  • Seyfert, L.; Ben Ammar, H.; Schwesinger, N.: "Flexoelectric Polarization of Piezoelectric PVDF-Films Above The Curie Temperature". Proceedings of the 2021 SMASIS, 2021 mehr…

2020

  • Anzinger, S.; Lickert, F.; Fusco, A.; Bosetti, G.; Tumpold, D.; Bretthauer, C.; Dehé, A.: Low Power Capacitive Ultrasonic Transceiver Array for Airborne Object Detection. IEEE 33rd International Conference on Micro Electro Mechanical Systems (MEMS), 2020 mehr…
  • Essing, S.; Behlert, R.; Hölzl, W.; Schrag, G.: Evaluation of the Electrode Design of an Integrated Bionic Microflapper for Improved Fluid Flow. Symposium on Design, Test, Integration & Packaging of MEMS and MOEMS (DTIP), 2020 mehr…
  • Okeil, H.; Schrag, G.; Wachutka G.: Design and Simulation of Novel Low-Voltage CMOS Vertical Hall Devices With Capacitively Coupled Measuring Contacts. IEEE Transactions on Electron Devices, 2020 mehr…
  • Seyfert, L.; Moritz L.; Ben Ammar, H.; Schwesinger, N.: Verification of the flexoelectric effect in PET polymer films for EH applications. SPIE Smart Structures + Nondestructive Evaluation, 2020online Only mehr…

2019

  • Behlert, R.; Schrag, G.: Evaluation of a Bionical Piezoelectric Micro-Flapper for Enhanced Fluid Flow Applying Numerical Simulations and Wavelet Transforms. Proc. Of Int. Conf. on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP 2019), 2019 mehr…
  • Hölzl, W.; Behlert, R.; Gehring, M. and Schrag, G.: Enhanced Fluid Flow by Wavelike Excitation of a Micromechanical Bending Actuator. 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2019 mehr…
  • Ampunant, W.; Ganzhorn, K.; Laumer, B.; Schrag, G.: Quantifying the mechanical reliability of MEMS using experimental and numerical methods. Mikrosystemtechnik Kongress, 2019 mehr…
  • Behlert, R.; Schrag, G.: Inspired by Nature: Efficient Piezoelectric MEMS Actuator Based on Wavelike Excitation. 20th International Conference on Solid-State Sensors, Actuators and Microsystems & Eurosensors XXXIII (TRANSDUCERS & EUROSENSORS XXXIII), 2019 mehr…
  • Bosetti, G.; Manz, J.; Dehé, A.; Krumbein, U.; Schrag, G.: Modeling and physical analysis of an out-of-plane capacitive MEMS transducer with dynamically coupled electrodes. Microsystem Technologies, 2019 mehr…
  • Huang, Y.; Lechner, B.; Wachutka, G.: Comparative Numerical Analysis of the Robustness of Si and SiC PiN Diodes Against Cosmic Radiation-induced Failure. Proceedings of ICSCRM 2019, 2019 mehr…
  • Lechner, B.: Temperaturabhängigkeit der bipolaren Aktivierung und der Leckstromdichten von 10 kV 4H-SiC JBS-Dioden. 48. Kolloquium Leistungshalbleiter-Bauelemente und ihre systemtechnische Integration, 2019 mehr…
  • Lechner, B.; Huang, Y.; Schaub, S.; Wachutka, G.: Temperature Dependence of the Bipolar Activation and the Leakage Currents of 10 kV 4H-SiC JBS-Diodes. Proceedings of ICSCRM, 2019 mehr…
  • Okeil, H.; Wachutka, G.: Design and Simulation of a Novel Vertical Hall Sensor With High Negative Differential Sensitivity. IEEE Magnetics Letters, 2019 mehr…
  • Seidl, M.; Klein, W.; Vobl, M.; Krumbein, U.; Schrag, G.: Design of a Micropump Based on an Industrial Microphone Manufacturing Process. Int. Conf. on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP), 2019 mehr…
  • Seidl, M.; Schrag, G.; Tumpold, D.: Entwicklung einer integrierten mikroelektromechanischen Pumpe für mobile Anwendungen. MikroSystemTechnik Kongress, 2019 mehr…
  • Seidl, M.; Schrag, G.; Tumpold, D.: MEMS Pump for Mobile Applications. Infineon Innovation Week – University Evening, 2019 mehr…
  • Seidl, M.; Gehring, M.; Krumbein, U. and Schrag, G.: Simulation-Based Design of an Electrostatically Driven Micro-Actuator for Fluid Transport in Mobile Applications. 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2019 mehr…
  • Seyfert, L.; Henneberg, A.; Schwesinger, N.: Possibilities of using flexoelectric effect for energy harvesting applications. SPIE Smart Structures + Nondestructive Evaluation Conference, 2019 mehr…
  • Wachutka, G.: High-Fidelity Predictive Simulation of High Power Devices and Modules at the Rim of the Safe-Operating Area and Beyond. PROC. 2019 IEEE 31st INTERNATIONAL CONFERENCE ON MICROELECTRONICS (MIEL), 2019 mehr…

2018

  • Kuenzig, T.; Dehe, A.; Krumbein, U.; Schrag, G.: Virtual design and optimization studies for industrial silicon microphones applying tailored system-level modeling. Journal of Micromechanics and Microengineering 28, 2018 mehr…
  • Basler V.; Wagner A.; Hoelzl W.; Wachutka W.: Dynamic Characterisation and Optimisation of Multiply Contacted Power Busbars. Proceedings of the 30th International Symposium on Power Semiconductor Devices and ICs (ISPSD), 2018Chicago, USA, 252-255 mehr…
  • Bosetti G.; Manz J.; Krumbein U.; Schrag G.: Reliable Compact Models for the Investigation of Acoustic High-Frequency Effects in MEMS Transducers. EUROSENSORS 2018, 2018Graz, Austria, 2018. mehr…
  • Gerstenmaier Y.C.; Wachutka G.: Thermionic Generators with Linear and Non-Linear Electron Dispersion Relations: Chances and Limits. Sustainable Industrial Processing Summit, 2018Rio de Janeiro, Brazil mehr…
  • Groos, G.; Helmut, D.; Wachutka, G.: The Latent Failure Issue Seen from the Other Side: Normal Operation after ESD Induced Degeneration of Devices and Systems. 40th Electrical Overstress/Electrostatic Discharge Symposium, 2018Reno, USA mehr…
  • Helmut, D.; Wachutka, G.; Groos, G.: Extracting Large-Signal Transient Characteristics of Power Electronic Devices Using Nanosecond Pulsing Techniques. European Conference on Power Electronics and Applications, 2018 mehr…
  • Huang, Y.; Lechner, B.; Wachutka, G.: The Impact of Non-ideal Ohmic Contacts on the Performance of High-Voltage SiC MPS Diodes. European Conference for Silicon Carbid and Related Materials, 2018 mehr…
  • Lechner B.; Huang Y.; Wachutka G.: Impact of the Activation of Carbon Vacancies at High Temperatures on the Minority Carrier Lifetimes in the Intrinsic Area of 4H-SiC PiN Rectifier. Proceedings of the 12th International Conference on Advanced Semiconductor Devices and Microsystems (ASDAM), 2018Smolencie, Slovakia, 9-12 mehr…
  • Lechner, B.; Huang, Y.; Wachutka, G.: Temperature Dependence of SRH Carrier Lifetimes in the Intrinsic Region of a 4H-SiC PiN Rectifier. European Conference for Silicon Carbid and Related Materials, 2018Birmingham, U.K. mehr…
  • Manz, J.; Schrag, G.; Dehe, A.; Krumbein, U.; Wachutka, G.: Investigations on a Novel Silicon MEMS Microphone Concept for a High Signal-to-Noise Ratio. MICROSYSTEMS TECHNOLOGY IN GERMANY 2018, 2018, pp. 54-55 mehr…
  • Okeil, H.; Wachutka, G.: A Perspective on Magnetic Field Sensors Operating Under Extreme High-Temperature Conditions. IEEE Transactions on Magnetics 55(1), 2018 mehr…
  • Seidl, M.; Schrag, G.; Krumbein, U.; Klein, W.; Vobl, M.: Micromechanical Actuator for Fluid Transport in Mobile Applications. Campeon Innovation Week 2018, Neubiberg, 2018, 2018 mehr…
  • Seidl, M.; Gehring, M.; Krumbein, U. and Schrag, G.: Simulation-based design of a micro fluidic transportation system for mobile applications based on ultrasonic actuation. 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, 2018Toulouse, France mehr…
  • Wachutka G.: Virtual Prototyping of High Power Devices and Modules. Forum on the Science and Technology of Silicon Materials, 2018 mehr…
  • Wachutka G.: High-Fidelity Predictive Simulation of μ-Structured Devices and Systems at the Rim of the Safe-Operating Area and Beyond. Proceedings of the 12th International Conference on Advanced Semiconductor Devices and Microsystems (ASDAM), 2018Smolencie, Slovakia, 187-194 mehr…

2017

  • Anzinger, S.; Manz, J.; Dehe, A.; Schrag, G.: A Comb-Based Capacitive MEMS Microphone with High Signal-to-Noise Ratio: Modeling and Noise-Level-Analysis. Proceedings of the Eurosensors 2017/Multidisciplinary Publishing Institute Proceedings, Vol. 1, 2017, 2017Paris, France mehr…
  • Behlert, R.; Gehring, M.; Mehner, H.; Wieland, R.; Schrag, G .: Entwicklung eines bionisch inspirierten, mikromechanischen Biegewandlers für effizienten fluidischen Massentransport. Proceedings of the MikroSystemTechnik Kongress, 2017 mehr…
  • Behlert, R.; Gehring, M.; Mehner, H.; Wieland, R.; Schrag, G.: Design, Modeling and Characterization of a Bionically Inspired Integrated Micro-Flapper for Cooling and Venting Applications. Proceedings of Eurosensor, 2017 Paris, France mehr…
  • Behlert, R.; Schrag, G.; Wachutka, G.: Efficient Fluid Transport by a Bionically Inspired Micro-Flapper: Fluidic Investigatins Using Fully Coupled Finite Element Simulation. Proceedings of SPIE Microtechnologies, 2017Barcelona, Spain mehr…
  • Bosetti, G.; Manz, J.; Schrag, G.; Dehe, A.: Modeling of an out-of-plane capacitive MEMS transducer with dynamically coupled electrodes. Proceedings of DTIP 2017, the Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP), 2017Bordeaux, France mehr…
  • Gehring, M.; Schrag, G.; Wachutka, G.: Effizienter fluidischer Transport mittels mikromechanischer Aktoren: Numerische Herausforderungen beim Entwurf / Efficient Transport of Fluids using Micromechanical Actuators: Numerical Challenges within the Design Process. Proceedings of the MikroSystemTechnik Kongress, Berlin Offenbach, 2017München, Deutschland mehr…
  • Gerstenmaier, Y.C.; Wachutka, G.: Thermoelectric converters with optimum graded materials and current distribution in one dimension and three dimensions. In: Physica Status Solidi B . Physica Status Solidi B , 2017, pp. 19 mehr…
  • Gerstenmaier, Y.C.; Wachutka, G.: Rigorous theory of graded thermoelectric converters including finite heat transfer coefficients. In: Journal of Applied Physics 122. Journal of Applied Physics, 2017, pp. 15 mehr…
  • Groos, G.; Wachutka, G.; Helmut, D.: The Latent Failure Issue Seen from the Other Side: Normal Operation after ESD Induced Degeneration of Devices and Systems. In: Journal of ESD. Journal of ESD, 2017 mehr…
  • Helmut, D.; Wachutka, G.; Groos, G.: ESD damage without failure, followed by EOS: A case study on automotive smart power IC's. Fachtagung Zuverlässigkeit und Entwurf, 2017 mehr…
  • Helmut, D.; Wachutka, G.; Groos, G.: Transient analysis of latent damage formation in SMD capacitors by Transmission Line Pulsing (TLP). 28th European Symposium on Reliability of Electron Devices, Failure Physics and Analysis, 2017Microelectronics Reliability, Vol. 76-77, 2017, pp. 97-101 mehr…
  • Korzenietz, A.; Wachutka, G; , Hille, F.; Sandow, C.; Niedernostheide, F.-J.: Free-Carrier Absorption Experiments for the Investigation of the Physical Device Properties in IGBTs with Hydrogen-Related Donors. Proceedings of ISPSD 2017, 2017Sapporo, Japan mehr…
  • Manz J.; Dehe A.; Schrag G.: Modeling high signal-to-noise ratio in a novel silicon MEMS microphone with comb readout. Proceedings of SPIE Microtechnologies 2017, 2017 Barcelona, Spain mehr…
  • Manz, J.; Bosetti, G.; Dehe, A.; Schrag, G: A novel silicon "star-comb" microphone concept for enhanced signal-to-ratio: modeling, design and first prototype. Proceedings of 19th International Conference on Solid-State Sensors, Actuators and Microsystems 2017, 2017Kaohsiung, Taiwan (Transducers), pp. 69-70 mehr…
  • Manz, J.; Schrag, G.; Dehe, A.; Krumbein, U.; Wachutka, G.: Modellierung eines neuartigen Kamm-Mikrofons mit hohem Signal-Rausch-Verhältnis. Proceedings of the MikroSystemTechnik Kongress 2017, 2017München, Deutschland mehr…
  • Schrag, G.: Virtuelles Prototyping - Entwurf von integrierten, multifunktionalen Mikrosystemen. Journal of TECHNIK IN BAYERN (TECHNIK IN BAYERN) (05/2017) 05, 2017, pp. 12-13 mehr…
  • Schrag, G.; Kuenzig, T.: Towards High Fidelity Silicon Microphones: Evaluating the Potential of Industrial Microsystems Applying Tailored System-level Models. Proceedings of 18th International Concerence on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, 2017Eurosime 2017, 6 mehr…
  • Schrag, G.; Kuenzig, T.; Wachutka, G.: Optimierung industrieller Mikrosysteme mit Hilfe maßgeschneideter Modelle: Systemsimulationen eines Silizium-Mikrophons. Proceedings of MikroSystemTechnik Kongress (VDE) 2017, 2017München, Deutschland, 2017, pp. 793-796 mehr…

2016

  • Basler, V.; Basler, T.; Pertermann, E.; Baburske, R.; Lutz, J.; Wachutka, G.: Compact PIN-Diode Model including Dynamic Avalanche and Lifetime Control in MATLAB. MATLAB 2016 2016 mehr…
  • Basler, V.; Hoelzl, W.; Wachutka, G.: Physical Modeling and High-Fidelity Simulation of the Transient Behavior of Multiply-Contacted Power Busbars. PCIM Europe 2016, 10 - 12 May, VDE Verlag GmbH, 2016, 543-549 mehr…
  • Behlert, R.; Schrag, G.; Wachutka, G.; Wieland, R.; Kutter, C.: Design of an Integrated Piezoelectric Micro-Flapper Based on Bionic Principles. Proceedings of Symposium on Design, Test, Integration & Packaging of MEMS and MOEMS, 2016, 79 - 82 mehr…
  • Huang, Y.; Erlbacher, T.; Buettner, J.; Wachutka, G.: A Trade-off Between Nominal Forward Current Density and Surge Current Capability for 4,5 kV SiC MPS Diodes. Proceedings of the 2016 28th International Symposium on Power Semiconductor Devices and ICs, 2016 mehr…
  • Huang, Y.; Wachutka, G.: Comparative Study of Contact Topographies of 4,5 kV SiC MPS Diodes for Optimizing the Forward Characteristics. Proceedings of Simulation of Semiconductor Processes and Devices, 2016, 117-120 mehr…
  • Schrag, G.; Kuenzig, T.; Dehe, A.: Enhanced Design of Microsystems by Combining Lumped and Distributed System-level Models. Proceedings of DTIP 2016, IEEE, 20162016, Symposium on Design, Test, Integration & Packaging of MEMS and MOEMS, 61-65 mehr…
  • Toechterle, C.; Pfirsch, F.; Sandow, C.; Wachutka, G.: Influence of Quasi-3D Filament Geometry onf the Latch-Up Threshold of High-Voltage Trench-IGBTs. Proceedings of Simulation of Semiconductor Processes and Devices, 2016, 177 - 180 mehr…

2015

  • Erlbacher, T.; Büttner, T.; Bauer, A.J.; Huang, Y.; Wachutka, G.; Frey, L.: Requirements and Design of 4,5 kV 4H-SiC Merged pin/Schottky Diodes for Wind power. Proceedings of the 39th Workshop on Compound Semiconductor Devices and Integrated Circuits, 2015WOCSDICE mehr…
  • Gawlina-Schmidl, Y.: Wachutka, G.; Schmitt-Landsiedel, D. (Hrsg.): Analyse ionenreduzierter Ausfallmechanismen in hochintegrierten CMOS-Speicherzellen. Band 49. Ausgewählte Probleme der Elektronik und Mikromechatronik. Shaker Verlag, 2015 mehr…
  • Künzig, T.; Schrag, G.; Dehe, A.; Wachutka, G.: Modeling Distributed Electrostatic Effects in Silicon Microphones and Their Impact on the Performance. Proceedings of SPIE 9517, Smart Sensors, Actuators, and MEMS VII and Cyber Physical Systems, 2015SPIE mehr…
  • Künzig, T.; Schrag, G.; Dehe, A.; Wachutka, G.: Performance and Noise Analysis of Capacitive Silicon Microphones Using Tailored System-Level Simulation. Proceedings of the 18th Int. Conf. on Solid State Sensors, Actuators and Microsystems, 2015, 2192-2195 mehr…
  • Manz, J.; Wachutka, G.; Schrag, G.: Fluidic Damping in Micro- and Nano-Scale Mechanical Resonators in the Molecular Flow Regime: A Momentum Transfer Based Analytical Approach. Proceedings of the 18th Int. Conf. on Solid State Sensors, Actuators and Microsystems, 2015 mehr…
  • Niessner, M.: Wachutka, G.; Schmitt-Landsiedel, D. (Hrsg.): Modellierung und Simulation des elektro-fluid-mechanisch gekoppelten Verhaltens von Mikrobauteilen auf der Systemebene. Band 48. Ausgewählte Probleme der Elektronik und Mikromechatronik. Shaker Verlag, 2015 mehr…
  • Reutter, T.: Wachutka, G. u. Schmitt-Landsiedel, D. (Hrsg.): Charakterisierung und Optimierung piezoelektrischer MEMS-Mikrophone mittels physikalischer Modellierung und Simulation. Band Vol. 47. Ausgewählte Probleme der Elektronik und Mikromechatronik. Shaker Verlag, 2015 mehr…
  • Schrag, G.: Künzig, T.; Glacer, C.; Dehe, A.; Wachutka, G.: Acoustic High-Frequency Effects Inside the Package of Capacitive Silicon Microphones and Their Impact on the Device Performance. Proceedings of SPIE 9517, Smart Sensors, Actuators, and MEMS VII and Cyber Physical Systems, 2015, 95170M1-95170M6 mehr…
  • Schrag, G.; Künzig, T.: Maßgeschneiderte Modelle für Mikrosysteme mit Hilfe verallgemeinerter Kirchhoffscher Netze. In: Nichtelektrische Netzwerke: Wie die Systemtheorie hilft, die Welt zu verstehen. TUDpress Dresdner Beiträge zur Sensorik, 2015, 37-46 mehr…
  • Weiß, Chr.: Wachutka, G. u. Schmitt-Landsiedel, D. (Hrsg.): Höhenstrahlungsresistenz von Silizium-Hochleistungsbauelementen. Band Vol. 46. Ausgewählte Probleme der Elektronik und Mikromechatronik. Shaker Verlag, 2015 mehr…
  • Wieland, R.; Nguyen, K.; Seidelmann, U.; Scholz, M.; Schrag, G.: Wafer edge protection kit for MEMS and TSV Si-Etching. Proceedings of SPIE 9517, Smart Sensors, Actuators, and MEMS VII and Cyber Physical Systems, 2015May 4-6, 2015, Barcelona, Spain, 951724-1 bis 951724-8 mehr…

2014

  • Behlert, R.: Künzig, T.; Schrag, G.: Wachutka, G.: Theoretical and Experimental Investigations on Failure Mechanisms Occuring During Long-Term Cycling of Electrostatic Actuators. 15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, 2014EuroSimE 2014 mehr…
  • Iannacci, J.; Serra, E.; Sordo, G.; Bonaldi, M.; Borrielli, A.; Schmid, U.; Bittner, A.; Schneider, M.; Kuenzig, T.; Schrag ,G.; Pandraud, G. and Sarro, P.M.: MEMS-Based Multi-Modal Vibration Energy Harvesters for Ultra-Low Power Autonomous Remote and Distributed Sensing. Proceedings of the 14th Mechatronics Forum International Conference, 2014Mechatronics 2014, June 16-18, Karlsstad, Sweden mehr…
  • Kuenzig, T.; Schrag, G.; Nawaz, M.; Herrmann, M.; Dehe, A.; Wachutka, G.: System-Level Modeling of Silicon Microphones Including Distributed Effects. EUROSENSORS 2014, the XXVIII edition of the conference series, Elsevier Procedia Engineering, 2014Brescia, Italy, Sept. 7-10, 2014 mehr…
  • Künzig, T.; Muschol, T.; Iannacci, J.; Schrag, G.; Wachutka, G.: Analysis of RF-MEMS Switches in Failure Mode: Towards a More Robust Design. 15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, 2014EuroSimE 2014 mehr…
  • Manz, J.; Schrag, G.; Wachutka, G.: Simulation and Measurement of Pressure Dependent Q-factors in NEMS Resonators. 15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, 2014EuroSimE 2014 mehr…
  • Manz, J.; Wachutka, G.; Schrag, G.: Systematic Investigation of Fluidic Damping in Mechanical Resonators with Dimensions Ranging from Micro- to Nano-Scale. EUROSENSORS 2014, the XXVIII edition of the conference series, Elsevier Procedia Engineering, 2014Brescia, Italy, Sept. 7-10, 2014 mehr…
  • Sandow, C.; Baburske, R.; Niedernostheide, F.-J.; Pfirsch, F.; Toechterle, C.: Exploring the Limits of the Safe Operation Area of Power Semiconductor Devices. Proceedings of the International Conference on Simulation of Semiconductor Processe and Devices, 2014SISPAD 2014, September 9-11, Yokohama, Japan, pp. 49-52 mehr…
  • Schrag, G.; Korzenietz, A.; Oberndörfer, J.; Wachutka, G.: Optoelectronic High Accurary Setup for the Analysis of Internal Temperature and Carrier Profiles in Semiconductor Power Devices. Proceedings of the 26th International Symposium on PowerSemiconductor Devices & IC´s, IEEE, 2014ISPSD´14 - June 15-19, 2014 Waikoloa, Hawaii, USA, 151-154 mehr…
  • Toechterle, C.; Pfirsch, F.; Sandow, C.; Wachutka, G.: Evolution of Current Filaments Limiting the Safe-Operating Area of High-Voltage Trench-IGBTs. Proceedings of the 26th International Symposium on PowerSemiconductor Devices & IC´s, IEEE, 2014ISPSD´14 - June 15-19, 2014 Waikoloa, Hawaii, USA, 135-138 mehr…
  • Wachutka, G.: Energy Harvesting Using Thermoelectric Microgenerators: A Critical Analysis. Proceedings of the 10th International Conference on Advanced Semiconductor Devices and Microsystems, 2014ASDAM 2014, October 20-22, Smolenice Castle, Slovakia, pp. 1-4 mehr…
  • Wachutka, G.: Virtual Testing of High Power Devices at the Rim of the Safe Operating Area and Beyond. Proceedings of the 26th International Symposium on PowerSemiconductor Devices & IC´s, IEEE, 2014ISPSD´14 - June 15-19, 2014 Waikoloa, Hawaii, USA, 6-11 mehr…

2013

  • Bechtold, T.; Schrag, G.; Feng, L. (Hrsg.): System-Level Modeling of MEMS. Advanced Micro & Nanosystems 10. Wiley-VHC, 2013 mehr…
  • Bechtold, T.; Schrag, G.; Feng, L.: Enabling Technologies for System-Level Simulation of MEMS. Proceedings of 14th International Conference on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems - EuroSimE, IEEE, 2013Wrozlaw, Poland, April 15-17, 2013 mehr…
  • Iannacci, J.; Serra, E.; Di Criscienzo, R.; Sordo, G.; Gotthardi, M.; Borrielli, A.; Bonaldi, M.; Künzig, T.; Schrag, G. ; Pandraud, G.; Sarro, P.M.: Multi-modal vibration based MEMS energy harvesters for ultra-low power wireless functional nodes. Microsystem Technologies vol. 19 (issue 12), 2013 mehr…
  • Iannacci, J.; Sordo, G.; Gotthardi, M.; Künzig, T.; Schrag, G., Wachutka, G.: An Energy Harvester Concept for Electrostatic Conversion Manufactured in MEMS Surface Micromachining Technology. Proceedings of the International Semiconductor Conference Dresden-Grenoble , 2013 ISCDG 2013, September 26-27, Dresden Germany mehr…
  • Müller, S.; Zahner, T.; Singer, F.; Schrag, G.; Wachutka, G.: Evaluation of Thermal Transient Characterization Methodologies for High-Power LED Applications. Microelectronics Journal 44 (11), 2013, 1005-1010 mehr…
  • Niessner, M.; Schrag, G.: Mixed-Level Approach for the Modeling of Distributed Effects in Microsystems. In: System-Level Modeling of MEMS. Wiley-VHC, 2013, pp. 163-189 mehr…
  • Schrag, G.; Künzig, T.; Niessner, M.: Problem-adapted Modeling of RF MEMS Switches. Proceedings of 16th International Conference on Sensors and Measurement Technology - AMA Sensor 2013, 2013Nürnberg, Germany, May 14-16, DOI 10.5162, pp. 186-191 mehr…
  • Schrag, G.; Künzig, T.; Wachutka, G.: Modeling Reliability Issues in RF MEMS Switches. Proceedings of the International Conference on Simulation of Semiconductor Processes and Devices, 2013SISPAD 2013, September 3-5, Glasgow, Scotland, UK, pp 432-435 mehr…
  • Schrag, G.; Reutter, T.; Wachutka, G.: Finite Element Simulations Combined with Statistical Analysis of Variance: Exploring the Potential of Piezoelectric MEMS Microphones. Proceedings of the 17th International Conference on Solid State Sensors, Actuators and Microsystems , IEEE, 2013TRANSDUCERS 16-20 June, 2013, Barcelona, Spain, pp. 1452-1455 mehr…
  • Schrag, G.; Wachutka, G.: System-Level Modeling of MEMS Using Generalized Kirchhoffian Networks - Basic Principles. In: System-Level Modeling of MEMS. Wiley-VHC, 2013, pp. 19-51 mehr…
  • Töchterle, C.; Pfirsch, F.; Sandow, C.; Wachutka, G.: Stromfilamentierungen und Latch-up-Grenze in 3,3kV-Trench-IGBTs. 42. Kolloquium Halbleiter-Leistungsbauelemente und ihre systemtechnische Anwendung, 201328.-29.10.2013, Freiburg i.B., Germany mehr…
  • Töchterle, C.; Pfirsch, F.; Sandow, C.; Wachutka, G.: Analysis of the Latch-up Process and Current Filamentation in High-Voltage Trench-IGBT Cell Arrays. Proceedings of the International Conference on Simulation of Semiconductor Processes and Devices, 2013SISPAD 2013, September 3-5, Glasgow, Scotland, UK, pp 296-299 mehr…
  • Wachutka, G.: The Art of Modeling and Predictive Simulation in Power Electronics and Microsystems. Proceedings of the 20th International Conference on Mixed Design of Intergrated Circuits and Systems, 2013MIXDES 2013, Gdynia, Poland, June 20-22, 48-52 mehr…
  • Zeising, V.; Basler, T.; Pertermann, E.; Lutz, J.; Wachutka, G.: Physikalisches Kompaktmodell für das Reverse-Recovery-Verhalten von PIN-Dioden mit dynamischem Avalanche und Lebensdauereinstellung. 42. Kolloquium Halbleiter-Leistungsbauelemente und ihre systemtechnische Anwendung, 201328.-29.10.2013, Freiburg i.B., Germany mehr…

2012

  • Gerstenmaier, Y. C.; Wachutka, G.: Unified theory for inhomogeneous thermoelectric generators and coolers including multistage devices. Physical Review E (E 86, 056703), 2012, 1-10 mehr…
  • Künzig, T.; Iannacci, J.; Schrag, G.; Wachutka, G.: Study of an active thermal recovery mechanism for an electrostatically actuated RF-MEMS switch. Proceedings of the 13th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, IEEE, 2012EuroSime 2012, April, 16-18, Cascais, Portugal mehr…
  • Künzig, T.; Schrag, G.; Iannacci, J.: Modeling and simulation of an active restoring mechanism for high reliability switches in RF-MEMS technology. Proceedings of the 23rd European Sysmposium on Reliability of Electron Devices, Failure Physics and Analysis, Elsevier, 2012ESREF2012, October 1-5, Cagliari, Italy mehr…
  • Künzig, T.; Schrag, G.; Iannacci, J.; Wachutka, G.: Improving the reliability of electrostatically actuated RF-MEMS switches: FEM simulations and measurements on a thermal recovery mechanism. Proceedings of the 13th Mechatronics Forum - International Conference, 2012Mechatronics 2012, Sept. 17-19, Linz, Austria, pp 340-345 mehr…
  • Niessner, M.; Schrag, G.; Iannacci, J.; Wachutka, G.: Squeeze-Film Damping in Perforated Microstructures: Modeling, Simulation and Pressure-Dependent Experimental Validation. Proceedings of the Nanotech - NSTI 2012- Vol. 2, 2012June 18-21, Santa Clara, CA, USA, pp. 598-601 mehr…
  • Oberndörfer, J.; Schrag, G.; Wachutka, G.: Efficient model for predictive MEMS microphone design: Model derivation and experimental verification. Proceedings of the EUROSENSORS XXVI, Elsevier, 2012EUROSENSORS 2012, September 9-12, Krakow, Poland mehr…
  • Weiss, Chr.; Wachutka, G.; Härtl, A.; Hille, F.; Pfirsch, F.: Predictive Physical Model of Cosmic-Radiation-Induced Failures of Power Devices. Proceedings of the 15th International Power Electronics and Motion Control Conference, EPE-PEMC 2012 ECCE Europe, 2012September, 4-6, Novi Sad, Serbia mehr…
  • Weiß, C.; Härtl, A.; Hille, F.; Pfirsch, F.; Wachutka, G.: Höhenstrahlungsresistenz von Silizium-Leistungsdioden. 41. Kolloquium Halbleiter-Leistungsbauelemente und ihre systemtechnische Anwendung, 201229. - 30. Oktober 2012, Freiburg i.B., Germany mehr…
  • Weiß, C.; Wachutka, G.: A numerical "a-posteriori"-Method to Calculate Local Self-Heating in Power Devices after the Impact of a Cosmic Particle. Proceedings of the International Conference on Simulation of Semiconductor Processes and Devices , 2012SISPAD 2012, September 5-7, Denver, CO, USA, pp. 35-38 mehr…
  • Weiß, C.; Wachutka, G.: Destructive Effects in Silicon Power Devices After the Impact of a Cosmic Particle. Proceedings of the 11th International Seminar on Power Semiconductors, 2012ISPS 2012, August 29-31, Prague, Czech Republic, pp. 49-52 mehr…

2011

  • Iannacci, J. ; Faes, A.; Künzig, T.; Niessner, M.; Wachutka, G.: Electromechanical and electromagnetic simulation of RF-MEMS complex networks based on compact modeling approach. Proceedings of TechConnect World NSTI Nanotech/Microtech 2011, 2011NSTI NANOTECH 2011, Boston, MA, USA, June 13-16, pp. 591-594 mehr…
  • Iannacci, J. ; Masotti, D.; Künzig, T.; Niessner, M.: A Reconfigurable Impedance Matching Network Entirely Manufactured in RF-MEMS Technology. Proceedings of SPIE: Smart Sensors, Actuators and MEMS V, 2011SPIE Microtechnologies 2011, April 18-20, Prague, Czech Republic, 80660X-1-12 mehr…
  • Knipper, U.: Untersuchungen zur Robustheit von IGBT-Chips im Lawinendurchbruch. Ausgewählte Probleme der Elektronik und Mikromechatronik 39. Shaker Verlag, 2011 mehr…
  • Müller, S.; Zahner, T.; Singer, F.; Schrag, G.; Wachutka, G.: Evaluation of Thermal Transient Characterization Methodologies for High.Power LED Applications. Proceedings of the 17th International Workshop on Thermal Investigations of ICs and Systems, 2011THERMINIC 2011, September 27-29, Paris, France mehr…
  • Niessner, M. ; Iannacci, J. ; Schrag, G.: Mechanical Contact in System-level Models of Electrostatically Actuated RF-MEMS Switches: Experimental Analysis and Modeling. Proceedings of SPIE: Smart Sensors, Actuators and MEMS V, 2011SPIE Microtechnologies 2011, April 18-20, Prague, Czech Republic, 80660Y-1-9 mehr…
  • Niessner, M. ; Schrag, G.; Iannacci, J. ; Wachutka, G.: Mixed-Level Modeling of Squeeze Film Damping in MEMS: Simulation and Pressure-Dependent Experimental Validation. Technical Digest of the 16th Int. Conference on Solid-State Sensors, Actuators and Microsystems -TRANSDUCERS` 2011, 2011June 5-9, Beijing, China, 1693-1696 mehr…
  • Niessner, M. ; Schrag, G.; Iannacci, J.; Wachutka, G.: "Macromodel-based simulation and measurement of thed ynamic pull-in of vicously damped RF-MEMS switches". Sensors and Actuators A (A 172), 2011, 269-279 mehr…
  • Niessner, M. ; Schrag, G.; Iannacci, J.; Wachutka, G.: COMSOL API based Toolbox for the Mixed-Level Modeling of Squeeze-Film Damping in MEMS: Simulation and Experimental Validation. Proceedings of the 5th Europeans COMSOL Conference, 2011COMSOL CONFERENCE 2011, October 26-28, Stuttgart, Germany mehr…
  • Schrag, G. ; Niessner, M. ; Wachutka, G.: Reliable system-level models for electrostatically actuated devices under varying ambient conditions: Modeling and validation. Proceedings of the Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, EDA Publishing/DTIP 2011, 2011DTIP 2011, May 11-13, Aix-en-Provence, France, pp. 8-13 mehr…
  • Sipilä, Pekka: Real-Time Magnetic Field Monitoring in Magnetic Resonance Imaging. Ausgewählte Probleme der Elektronik und Mikromechatronik 40. Shaker Verlag, 2011 mehr…
  • Wachutka, G.: Modellierung verteilter physikalischer Koppeleffekte in Leistungs-Bauelementen und Modulen. Bauelemente der Leistungselektronik und ihre Anwendungen - Vorträge der 6. ETG-Fachtagung, VDE Verlag, 201113.-14. April, Bad Nauheim, pp. 102-111 mehr…
  • Weiß, C.; Aschauer, S. ; Wachutka, G. ; Härtl, A. ; Hille, F. ; Pfirsch, F.: Numerische Untersuchungen zum Ausfall von Leistuungsdioden aufgrund von Höhenstrahlung. 40. Kolloquium Halbleiter-Leistungsbauelemente und ihre systemtechnische Anwendung, 20112011, Oktober 24-25, Freiburg i. B., Germany mehr…
  • Weiß, C.; Aschauer, S. ; Wachutka, G. ; Härtl, A. ; Hille, F. ; Pfirsch, F.: Numerical Analysis of Cosmic Radiation-Induced Failures in Power Diodes. Proceedings of the European Solid-State Device Research Conference 2011, 2011ESSDERC 2011, Sept. 12-16, Helsinki, Finnland, pp. 355-358 mehr…

2010

  • Gerstenmaier, Y.G.; Wachutka, G.: "The Problem of Infinitely Cascaded Thermoelectric Converters and their Optimization". International Workshop on Thermal Investigations of ICs and Systems - THERMINIC, 2010October 6-8, Barcelona, Spain, pp. 133-138 mehr…
  • Herz, M.; Horsch, D.; Wachutka, G.; Lueth, T.; Richter, M.: "Design of ideal circular bending actuators for high performance micropumps". Sensors and Actuators A (Vol 163 / 1), 2010 mehr…
  • Iannacci, J. ; Repchankova, A. ; Faes, A.; Tazzoli, A. ; Niessner, M.: "Experimental Investigation on the Exploitation of an Active Mechanism to Restore the Operability of Malfunctioning RF-MEMS Switches". Proceedings of EUROSENSORS XXIV, 2010September 5-8, 2010, Linz, Austria mehr…
  • Khalilyulin, R.; Schrag, G.; Wachutka,G.: "Calibration and Validation Procedure for Reliable and Predictive High-level Transducer Models suited for System-level Design". TechConnect World / Nanotech Conference & Expo , 2010June 21-24, 2010 Anaheim, CA, USA, pp. 581-584 mehr…
  • Khalilyulin, R.; Steinhuber, T. ; Reutter, T.; Wachutka,G. ; Schrag, G.: "Modeling Approach for Full-System Design and Rapid Hardware Prototyping of Microelectromechanical Systems". Proceedings of the Ninth IEEE Sensors Conference , 2010Nov. 1-4, 2010, Kona, Hawaii, pp. 1405-1410 mehr…
  • Khalilyulin, R.; Steinhuber, T. ; Schrag, G.; Wachutka,G.: Hardware/Software Co-Simulation for the Rapid Prototyping of an Acceleration Sensor System with Force-Feedback Control. Proceedings of the 40th European Solid-State Device Research Conference - ESSDERC, 2010September, 14-16, 2010, Seville, Spain, pp. 186-189 mehr…
  • Künzig, T.; Niessner, M. ; Wachutka, G.; Schrag, G.; Hammer, H.: "The Effect of Thermoelastic Damping on the Total Q-Factor of State-of-the-Art MEMS Gyroscopes with Complex Beam-Like Suspensions". Proceedings of EUROSENSORS XXIV, 2010September 5-8, 2010, Linz, Austria mehr…
  • Niessner, M. ; Iannacci, J. ; Peller, A.; Schrag, G.; Wachutka, G.: "Macromodel-Based Simulation and Measurement of the Dynamic Pull-in of Vicously Damped RF-MEMS Switches". Proceedings of EUROSENSORS XXIV, 2010September 5-8, 2010, Linz, Austria mehr…
  • Niessner, M. ; Iannacci, J. ; Schrag, G. ; Wachutka, G.: "Experimental Analysis and Modeling of the Mechanical Impact during the Dynamic Pull-In of RF-MEMS Switches". International Conference on Advanced Semiconductor Devices and Microsystems - ASDAM, 2010Oct. 25-27, 2010, Smolenice Castle, Slovakia, pp. 267-270 mehr…
  • Niessner, M. ; Schrag, G. ; Iannacci, J. ; Wachutka, G.: "Validation of a Multi-Energy Domain Coupled Macromodel for Viscously Damped MEMS at Varying Pressure Conditions". 4th European Conference on Computational Mechanics, Solids, Structures and Coupled Problems in Engineering - ECCM, 2010May 16-21, Paris, France, CD-ROM mehr…
  • Niessner, M. ; Schrag, G. ; Wachutka, G.; Iannacci, J.: "Modeling and fast simulation of RF-MEMS switches within standard IC design framework". Proceedings of the 15th International Conference on Simulation of Semiconductor Processe and Devices - SISPAD, 2010September, 6-8, 2010, Bologna, Italy, pp. 317-320 mehr…
  • Reutter, T.; Schrag, G.: Reliable Piezoelectric FEM-Simulations of MEMS Microphones: Basis for Intrinsic Stress Reduction". Proceedings of the Ninth IEEE Sensors Conference , 2010Nov. 1-4, 2010, Kona, Hawaii, pp. 193-196 mehr…
  • Wachutka, G.; Böhm, P.: "Physics-Based Modeling of Electromagnetic Parasitic Effects in Interconnects and Busbars". International Conference on Advanced Semiconductor Devices and Microsystems - ASDAM, 2010Oct. 25-27, 2010, Smolenice Castle, Slovakia, pp. 313-316 mehr…
  • Werber, D. ; Aigner, M.; Wachutka, G.: "Optical Insights into the Internal Electronic and Thermal Behavior of 4H-SiC Bipolar Devices". Materials Science Forum Vols. 645-648, 2010, pp 1041-1044 mehr…
  • Xiong,L.; Wachutka, G.; Pieper, K.-W.: "Modeling of self-heating effect of poly-resistors" Modellierung der Selbsterwärmung von Polywiderständen. ANALOG 2010 Entwicklung von Analogschaltungen mit CAE-Methoden - ITG-Fachbericht 221, 201011. ITG/GMM-Fachtagung 22.03.2010-24.03.2010 in Erfurt, Germany, pp 71-76 mehr…

2009

  • Fulde, M.; Heigl, A. ; Wachutka, G. ; Knoblinger, G. ; Schmitt-Landsiedel, D. :: "Complementary Multi-Gate Tunneling FETs: Fabrication, Optimisation and Application Aspects". International Journal of Nanotechnology (IJNT) Vol. 6 (Issue 7/8), 2009, pp. 628-639 mehr…
  • Gerstenmaier, Y.G.; Kiffe, W.; Wachutka, G.: "Combination of Thermal Subsystems by Use of Rapid Circuit Transformation and Extended Two-Port Theory". Microelectronics Journal (Vol. 40 / 1), 2009, pp. 26-34 mehr…
  • Heigl, A. ; Schenk, A. ; Wachutka, G. :: "Correction to the Schenk Model of Band-toBand Tunneling in Silicon Applied to the Simulation of Nanowire Tunneling Transistors". 13th International Workshop on Computational Electronics, IWCE2009 (Print and CD-ROM), 200927.05.-29.05.2009, Tsinghua University, Beijing, China mehr…
  • Heigl, A. ; Wachutka, G. ;: "Detailed Analysis of Quantum-Effects in Nanowire Tunneling Transistors with Channel-Profiles". Nanotech Conference & Expo 2009 ( Print and CD-ROM), CRC Press, 200903.-07.05.2009 Houston, TX, USA, pp.590-593 mehr…
  • Iannacci, J. ; Repchankova, A. ; Macii, D. ; Niessner, M.: "A Measurement Procedure of Technology-related Model Parameters for Enhanced RF-MEMS Design ". Proceedings of the IEEE Advanced Methods for Uncertainty Estimation in Measurement International Workshop - AMUEM 2009, 2009July 6-7 2009, Bucharest, Romania, pp. 44-49 mehr…
  • Khalilyulin, R.; Schrag, G.; Wachutka,G.;: "Experimental calibration and validation of a micromechanical accelerometer model suited for system-level design". Proceedings of EUROSENSORS XXIII, 2009September 6-9, 2009, Lausanne, Schweiz, pp. 128-131 mehr…
  • Niessner, M. ; Schrag, G. ; Iannacci, J. ; Wachutka, G.: "Experimentally Validated and Automatically Generated Multi-Energy Domain Coupled Model of a RF-MEMS Switch". Proceedings of the 10th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems - EuroSimE 2009, 2009April 27-29, Delft, The Netherlands, pp. 595-600 mehr…
  • Niessner, M. ; Schrag, G. ; Wachutka, G.; Iannacci, J.: "Verifizierung eines nichtlinearen Modells für einen gedämpften ohmschen HF-Schalter bei unterschiedlichen Druckbedingungen". Proceedings MikroSystemTechnik Kongress, 200912.-14. Oktober 2009, Berlin mehr…
  • Niessner, M. ; Schrag, G. ; Wachutka, G.; Iannacci, J. ; Reutter, T. ; Mulatz, H.: "Non-linear model for the simulation of viscously damped RF-MEMS switches at varying ambient pressure conditions". Proceedings of EUROSENSORS XXIII, 2009September 6-9, 2009, Lausanne, Schweiz, pp. 618-621 mehr…
  • Niessner, M. ; Schrag, G. ; Wachutka, G. ; Iannacci, J. ; Margesin, B.: "Automatisiert erstelltes und experimentell verifiziertes Mixed-Level-Modell für einen mikromechanischen HF-Schalter". 7. GI/GMM/ITG-Workshop Multi-Nature-Systems: Entwicklung von Systemen mit elektronischen und nichtelektronischen Komponenten, 20092. Febr. 2009, Ulm, Germany mehr…
  • Niessner, M. ; Schrag, G. ; Wachutka, G. ; Iannacci, J. ; Margesin, B.: "Automatically Generated and Experimentally Validated System-Level Model of a Microelectromechanical RF Switch". Proceedings of the NSTI Nanotechnology Conference and Trade Show 2009, 2009NSTI Nanotech 2009, May 3-7, Houston, TX, USA, pp. 655-658 mehr…
  • Pakar, H. ; Schrag, G. ; Wachutka, G.: "A Novel Low Input Voltage Driver Circuit For Piezoelectrically Driven Microactuators". MicoMechanics Europe - MME 2009, 2009Sept. 20-22, 2009, Toulouse, France mehr…
  • Reinelt, N.; Schmitt, M.; Willmeroth, A.; Kapels, H.; Wachutka,G.: "Increasing the Breakdown Capability of Superjunction Power MOSFETs at the Edge of the Active Region". Proceedings of the 13th International European Power Electronics Conference and Exhibition - EPE 2009, 2009September, 8-10, 2009, Barcelona, Spain mehr…
  • Repchankova, A.; Iannacci, J.; Niessner, M.;: "Aspects of Mechanical Reliability for RF-MEMS Switches with Self-Recovery Mechanism to Counteract Stiction". Proceedings of the XXXVIII AIAS Association National Congress, 2009September, 9-11, Torino, Italy, pp. 225-226 mehr…
  • Schrag, G. ; Khalilyulin, R. ; Wachutka, G.: "Virtuelles Prototyping "smarter" Sensorsysteme: Physikalisch basierte Modellierung am Beispiel eines mikromechanischen Gyroskops". In: Prof. Dr.-Ing. Ulrich Brill (Ed.) (Hrsg.): Haus der Technik Fachbuch. expert Verlag, 2009, pp. 184-208 mehr…
  • Schrag, G. ; Niessner, M. ; Khalilyulin, R. ; Wachutka, G.: "Virtual Micromechatronics: Physically Consistent Efficient Multi-Energy Domain Modeling". Proceedings of the 3rd International Conference on Automotive Power Electronics - APE 2009, 2009March, 25-26, 2009 Paris, France mehr…
  • Werber, D. ; Aigner, M.; Wachutka, G.: "Optical Insights into the Internal Electronic and Thermal Behavior of 4H-SiC Bipolar Devices". Proceedings of the 13th INternational Conference on Silicon Carbide and Related Materials - ICSCRM 2009, 2009October, 11-16, 2009, Nürnberg, Germany mehr…
  • Werber, D. ; Wachutka, G.: "Combined Model Validation Platform for the Temperature and Charge Carrier Distributions in 4H-SiC Bipolar Diodes Exploiting the Plasma- and Thermo-Optical Effects". Proceedings of 3rd International Conference on Automotive Power Electronics - APE 2009, 2009March, 25-26, 2009, Paris, France mehr…
  • Werber, D. ; Wachutka, G.: "Physical Modeling of SiC Devices Based on the Optical Characterization of their Internal Electrothermal Behavior". Proceedings of the International Semiconductor Device Research Symposium - ISDRS 2009, 2009December, 9-11, 2009, University of Maryland, College Park, MD, USA mehr…
  • Werber, D. ; Wachutka, G.: "Messergebnisse für SiC-Bauelemente aus dem Mirageexperiment". 38. Kolloquium Halbleiterbauelemente und ihre systemtechnische Anwendung, 2009Oktober, 30.-31., 2009, Freiburg i.B. mehr…
  • Werber, D. ; Wachutka, G.: "Laser Deflection Measurements for the Determination of Temperature and Charge Carrier Distributions in 4H-SiC Power Diodes". In: Materials Science Forum Vol. 615-617. Trans Tech Publications, 2009, pp. 267-270 mehr…
  • Werber, D.; Aigner, M.; Denoth, D.; Wittmann, F.; Wachutka, G.;: "Investigation of the Internal Carrier Distribution in 4H-SiC pin-Diodes by Laser Absorption Experiments". Materials Science Forum Vol. 600-603 Part 1., 2009, pp. 493-496 mehr…
  • Zöpfl, T. ; Klare, S. ; Wachutka, G. ; Schrag, G.: "Characterisation of the intrinsic stress in micromachined parylene membranes". Proceedings of SPIE: Smart Sensors, Actuators and MEMS IV, 2009SPIE 2009, May 4-6 , Dresden, Germany, pp. 73621M-1-11 mehr…

2008

  • Bedyk, W. ; Niessner, M. ; Schrag, G. ; Wachutka, G. ; Margesin, B. ; Faes, A.: Automated extraction of multi-energy domain reduced-order models demonstrated on capacitive MEMS microphones. Sensors and Actuators A Physical, 2008 mehr…
  • Borthen, P.; Wachutka, G.: "Testing semiconductor devices at extremly high operating temperatures". Proceedings of the 19th European Symposium on Reliability of Electron Devices, Failure Physics and Analysis - ESREF -, 2008Sept. 29 to Oct. 2, 2008, Maastricht, The Netherlands mehr…
  • Borthen, P.; Wachutka, G.: "Testing semiconductor devices at extremly high operating temperatures". Microelectronics Reliability Vol 28, issues 8-9, special issue ESREF 2008, 2008, pp.1440-1443 mehr…
  • Borthen, P.; Terhorst, M.; Heinzerling, G.; Wachutka, G.: "Hochtemperaturmessungen mit kurzen Pulsen". 37. Kolloquium "Halbleiter-Leistungsbauelemente und ihre systemtechnische Anwendung", 200827.10.2008-28.10.2008, Freiburg i. B. mehr…
  • Borthen, P.; Wachutka, G.: Ein Meßplatz für die Untersuchung von Halbleiterbauelementen bei sehr hohen Umgebungstemperaturen. ANALOG´08 02.04.-04.04.2008 Siegen, GMM-Fachbericht 56, VDE-Verlag, 2008, 81-86 mehr…
  • Borthen, P.; Wachutka, G.,: Characterisation of Semiconductor Devices at Very High Temperatures. 7th International Conference on Advanced Semiconductor Devices and Microsystems - ASDAM ´08, 200812.10.2008 - 16.10.2008, Smolenice Castle, Slovakia, pp. 71-74 mehr…
  • Fulde, M.; Heigl, A. ; Wirnshofer, M. ; v. Arnim, K. ; Nirschl, Th. ; Sterkel, M. ; Knoblinger, G. ; Hansch, W. ; Wachutka, G. ; Schmitt-Landsiedel, D.: Fabrication, Optimization and Application of Complementary Multiple-Gate Tunneling FETs. IEEE International Nanoelectronics Conference - INEC2008, May 24-27 2008, Shanghai, China, 2008, pp. 946-951 mehr…
  • Gawlina, Y.; Borucki, L.; Georgakos, G,: Wachutka, G.: "Strahlungsbedingte Ausfälle des Logikteils von HV-ICs in CMOS-Technologie". 37. Kolloquium "Halbleiter-Leistungsbauelemente und ihre systemtechnische Anwendung", 200827.10.2008-28.10.2008, Freiburg i. B. mehr…
  • Gerstenmaier, Y.G.; Wachutka, G.: "The Minimal Set of Parameters for Exact Dynamic Thermal Models". Proceedings of the 14th International Workshop on THERMal INvestigation of ICs and Systems - THERMINIC, 2008Sept. 24-26, 2008, Rome, Italy, pp.70-75 mehr…
  • Heigl, A. ; Wachutka, G. ;: Study on the Optimized Design of Nanowire Tunneling Transitors Including Quantum Effects. International Conference on Simulation of Semiconductor Processes and Devices - SISPAD `08, 200809.09.2008-11.09.2008, Hakone, Japan, pp. 225-228 mehr…
  • Heigl, A. ; Wachutka, G. ;: Quantum-Corrected Simulation of Complementary Nanowire Tunneling Transistors of 5 nm Gate-Length,. 7th International Conference on Advanced Semiconductor Devices and Microsystems - ASDAM ´08, 200812.10.2008 - 16.10.2008, Smolenice Castle, Slovakia, pp. 115-118 mehr…
  • Khalilyulin, R. ; Schrag, G. ; Wachutka, G.: Physically-Based High-Level System Model of a MEMS-Gyroscope for the Efficient Design of Control Algorithms,. Proceedings of the NSTI Nanotechnology Conference and Trade Show 2008, June 1-5 2008, Boston MA, USA, 2008, pp. 505-508 mehr…
  • Knipper, U. ; Pfirsch, F. ; Raker, T. ; Niedermeyr, J. ; Wachutka, G.: Time-Periodic Avalanche Breakdown at the Edge Termination of Power Devices. Proceedings of the 20th International Symposium on Power Semiconductor Devices & ICs-ISPSD2008, May 18-22 2008, Orlando FL, USA, 2008 mehr…
  • Knipper, U. ; Pfirsch, F. ; Raker, T. ; Niedermeyr, J. ; Wachutka, G.: Destruction in the Active Part of an IGBT Chip Caused by Avalanche-Breakdown at the Edge Termination Structure,. 7th International Conference on Advanced Semiconductor Devices and Microsystems - ASDAM ´08, 200812.10.2008 - 16.10.2008, Smolenice Castle, Slovakia, pp.159-162 mehr…
  • Knipper, U.; Pfirsch, F.; Raker, T.; Niedermeyr, J.; Wachutka, G.: "Zerstörung im aktiven Teil eines IGBT-Chips ausgelöst durch Avalanche-Durchbruch am Randabschluss". 37. Kolloquium "Halbleiter-Leistungsbauelemente und ihre systemtechnische Anwendung", 200827.10.2008-28.10.2008, Freiburg i. B. mehr…
  • Niessner, M. ; Schrag, G. ; Wachutka, G.: Reduced-Order Modeling and Coupled Multi-Energy Domain Simulation of Damped Highly Perforated Microstructures,. 8th World Congress on Computational Mechanics - WCCM 8 / 5th European Congress on Computational Methods in Applied Sciences and Engineering - ECCOMAS 2008, 200830.06.2008 - 04.07.2008, Venice, Italy mehr…
  • Pakar, H.; Schrag, G.; Wachutka, G.;: Power Efficient Circuit Concepts for Piezoelectrically Driven Microactuators. Technical Digest of the 19th MicroMechanics Europe Workshop - MME2008, 200828.09.2008 -30.09.2008, Aachen, Germany, pp. 61-64 mehr…
  • Permthammasin, Komet: Optimierung der elektrischen Eigenschaften von lateralen Superjunction-Bauelementen. Shaker Verlag, 2008 mehr…
  • Pobering, S.; Schwesinger, N.;: A Piezoelectric Energy Harvesting Device-Design, Simulation, Latest Results,. EUROSENSORS XXII, 200807.09.208 - 10.09.2008, Dresden, pp. 147-150 mehr…
  • Pobering, S.; Warthmüller, J.; Schweps, S. ; Schwesinger, N.;: A Novel Piezoelectric Actuator with a Double Concentric Electrode Structure. Technical Digest of the 19th MicroMechanics Europe Workshop - MME2008, 200828.09.2008 -30.09.2008, Aachen, Germany, pp. 205-208 mehr…
  • Schrag, G. ; Khalilyulin, R.; Niessner, M.; Wachutka, G.,: Hierarchical Modeling Approach for Full-System Design and Control of Microelectromechanical Systems. EUROSENSORS XXII, 200807.09.208 - 10.09.2008, Dresden, pp. 528-531 mehr…
  • Sipilä, P. ; Lechner, S. ; Lange, D. ; Greding, S. ; Wachutka, G.; Wiesinger, F.: A Magnetic Field Monitoring Add-on Toolkit Based on Transmit-Receive NMR Probes. Proceedings of the 16th Scientific Meeting of the International Society of Magnetic Resonance in Medicine- ISMRM2008, May 3-5 2008 Toronto, Canada, 2008 mehr…
  • Sipilä, P. ; Lechner, S. ; Lange, D. ; Greding, S. ; Wachutka, G.; Wiesinger, F.: Robust susceptibility-matched NMR probes for compensation of magnetic field imperfections in magnetic resonance imaging (MRI). Sensors and Actuators A Physical, 2008 mehr…
  • Wachutka, G.: Virtual Prototyping of Microdevices and Microsystems,. Proceedings of the Distributed Intelligent Systems and Technologies Workshop 2008, June 9-11 2008, St. Petersburg, Russia, 2008, pp. 155-162 mehr…
  • Wachutka, G.: Virtual Experiments with Power Devices Using Predictive Simulation. 9th International Seminar on Power Semiconductors 2008 - ISPS `08, 200827.08.2008 - 29.08.2008, Prag, Czech Republic mehr…
  • Werber, D. , Wachutka, G.: Time-resolved Investigation on the Internal Carrier Distribution in 4H-SiC pin Diodes by Laser Absorption Experiments. 9th International Seminar on Power Semiconductors 2008 - ISPS `08, 200827.08.2008 - 29.08.2008, Prag, Czech Republic mehr…
  • Werber, D. ; Wachutka, G.: "Laser Deflection Measurement for the Determination of Temperature and Charge Carrier Distributions in 4H-SiC Power Diodes". 7th European Conference on Silicon Carbide and Related Materials -ECSCRM 2008, 2008Sept. 7-11, 2008, Barcelona, Spain, pp. 267-270 mehr…
  • Werber, D.; Wachutka, G.,: Interpretation of Laser Absorption Measurements on 4H-SiC Bipolar Diodes by Numerical Simulation. International Conference on Simulation of Semiconductor Processes and Devices - SISPAD `08, 200809.09.2008-11.09.2008, Hakone, Japan, pp. 89-92 mehr…
  • Zöpfl, T.; Wittman, F.; Schrag, G.; Wachutka, G. ; Schicke, M.: FEM Simulation and Optimization of the Electromechanical Behaviour of a Variable Superconduction Niobium Capacitor. Sensors and Materials, 2008 mehr…
  • Zöpfl, T.; Wittman, F.; Schrag, G.; Wachutka, G.,: High-Fidelity 3D FEM Simulation Model for Stress Reduction in MEMS Microphones. EUROSENSORS XXII, 200807.09.208 - 10.09.2008, Dresden, pp. 68-71 mehr…
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