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FEM simulation (COMSOL Multiphysics) of thermoplastic polyurethane substrates with functional silver structures at 35% strain. Red areas indicate high acting stresses whereas blue segments are less affected by the stresses.

Stretched thermoplastic polyurethane (TPU) sheets with EHD-printed silver-based meanders. (a) TPU at the initial state. (b) TPU at approximately 50% strain.

We are happy to announce that the manuscript “Conformable Electronics With Conductive Silver Structures by Electrohydrodynamic Printing”, authored by our PhD student Nadine Philippin, is now published in the IEEE Journal on Flexible Electronics.

The paper examines innovative methods for manufacturing flexible electronics using conductive silver structures. It looks at the process of electrohydrodynamic printing and highlights its potential applications and benefits in the field of flexible electronics.

Its online available at https://ieeexplore.ieee.org/document/10577118

DOI: doi:10.1109/JFLEX.2024.3420263

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Doctoral Candidate Nadine Philippin’s Work Published in IEEE Journal on Flexible Electronics